Soldering materials, solder the release of cell cellphone repair

The process of fix cell cellphone, and sometimes will need to wake up the various elements of welding, soldering, solder has excellent actual physical qualities and technical qualities and excellent wetting and weldability, when servicing will often use to solder. Solder liquefy during welding for electronic elements and product pad so that the workpiece is carefully related with the birdwatcher atoms; temperature at this time so that the solder to liquefy, rather than make the birdwatcher atoms liquefy. Compliance with worldwide practice, the gadgets industry, welding below 450 ℃, while the solder reducing factor reduced than 250 ℃

        The solder is a typical steel, usually tin and cause steel. About 232 ℃ reducing factor of genuine tin, genuine cause, the reducing factor of roughly 327 ° C, the steel reducing factor usually reduced than the reducing factor of tin or cause, the reducing factor is determined by the rate of the steel structure.

        Nowadays with the significantly popular on the environment due to the cause on the bodies neurological program, extra, serious harm, the use of lead-free solder has become the pattern of the periods. In order to enhance the excellent of lead-free solder joint parts to achieve the tin and cause steel actual physical qualities, technical qualities, as well as wetting and weldability, and added some materials such as bismuth (Bi), gold (Ag), indium ( in), birdwatcher (Cu), dime (Ni), antimony (Sb) to enhance the excellent of solder joint parts.

         Here is some of the different elements of the solder reducing point:

 Substances reducing factor (℃)
 Sn60/Pb40 189
 Sn99.3/Cu0.7 227
 Sn42/Bi58 180
 Sn95.5/Ag4.0/Cu0.5 217 ~ 218
 Sn96.5/Ag3.5 221

         Worldwide recognized best solder for: Sn96.5/Ag3.0/Cu0.5.

         Solder shape of a variety of the most typical filamentous debris, pills, stays and installed in the tank in the solder insert. Crushed, pills, pieces of solder for tin air conditioner or pattern soldering; solder insert for reflow soldering of SMT components; filamentous tin cable for side soldering. For side soldering tin cable can be selected according to the pad area the size of the component pin, slim tin cable for the welding of small solder joint parts, wide solder cable for welding of tin factor so that the tin content managed.

         More harmful steel containing tin cable, will have some impact on individual health.


For more information please click:Cell Phone Accessories
URL:www.cyber-mon.com